Lv2
116 积分 2025-12-24 加入
Tracking the correlation between spintronic structure and oxygen evolution reaction mechanism of cobalt-ruthenium-based electrocatalyst
3天前
已完结
Comparison of effective parameters for copper powder production via electrorefining and electrowinning cells and improvement using DOE methods
19天前
已完结
Monte Carlo Simulation of the Electrodeposition of Copper
29天前
已完结
Electrodeposition of Copper in the SPS-PEG-Cl Additive System
1个月前
已完结
Modeling Extreme Bottom-Up Filling of Through Silicon Vias
1个月前
已完结
Galvanostatic studies of the kinetics of deposition and dissolution in the copper + copper sulphate system
3个月前
已完结
Inhibition Due to the Interaction of Polyethylene Glycol, Chloride, and Copper in Plating Baths: A Surface-Enhanced Raman Study
4个月前
已完结
The chemistry of additives in damascene copper plating
4个月前
已完结
A Time-Dependent Transport-Kinetics Model for Additive Interactions in Copper Interconnect Metallization
4个月前
已完结
Influence of Chloride Anions on the Mechanism of Copper Electrodeposition from Acidic Sulfate Electrolytes
4个月前
已完结
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