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32 积分 2025-12-24 加入
Superconformal film growth: Mechanism and quantification
2小时前
已完结
Electrodeposition of Copper in the SPS-PEG-Cl Additive System
2小时前
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Inhibition of Copper Deposition by Polyethylene Glycol and Chloride I. Model Development and Parameter Estimation
2个月前
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Differentiable Electrochemistry: A Paradigm Characterizing Physical Laws in Electrochemical Systems
3个月前
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The Effect of Slow Two‐Electron Transfers and Disproportionation on Cyclic Voltammograms
3个月前
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Diffusion in aqueous copper sulfate and copper sulfate-sulfuric acid solutions
3个月前
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A kinetic model for the dissolution mechanism of copper in acidic sulfate solutions
3个月前
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Current-time behaviour for copper electrodeposition. I. Theoretical analysis based on a surface diffusion model
3个月前
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Coarse-Grained Kinetic Monte Carlo Simulation of Copper Electrodeposition with Additives
3个月前
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Electrodeposition of Copper in the SPS-PEG-Cl Additive System
3个月前
已完结
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