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38 积分 2026-08-11 加入
A lightweight high precision real-time system for bonding ball–pad localization in industrial packaging inspection
1天前
已完结
基于CTM-IYOLOv10网络的晶圆缺陷检测技术
1天前
已完结
Design and simulation of a manifold–pin–fin hybrid heat sink for non-uniform heat sources
1天前
已完结
An overview of infrared thermography for inspection of solder joint in electronic devices
1天前
已完结