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1028 积分 2025-02-27 加入
An insight into the triple-laser processing mechanism for producing nanometer-scale smooth surfaces on single-crystal diamond
5天前
已完结
Stress-driven exfoliation and structural evolution in diamond under femtosecond laser
5天前
已完结
Interaction mechanism between femtosecond laser and diamond
5天前
已完结
Laser machining of silicon carbide: current status, applications and challenges
6天前
已完结
Formation mechanism of surface quality in 4H-SiC wafers sliced via picosecond laser with gradient Energy-Modulation Multi-Pass modification process
6天前
已完结
Study on picosecond laser multi-layer modification and stealth dicing of 4H-SiC wafers based on laser power modulation
6天前
已完结
Regulating random crack propagation in laser slicing of 4H-SiC wafer via classification characterization and energy-crack morphology mapping
6天前
已完结
Toward low-loss and low-roughness laser readily separable slicing of SiC wafers: The role of temporal pulse bursts
6天前
已完结
SiC laser slicing based on crack propagation control
6天前
已完结
Thermal stress manipulated nano-crack growth for high-quality and low Kerf-loss SiC slicing via orthogonally polarized dual-beam nanosecond laser irradiation
6天前
已完结
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