Lv11
30 积分 2025-03-11 加入
Embedding of Chips for System in Package realization - Technology and Applications
1小时前
已采纳
Geometric calibration of focused light field camera for 3-D flame temperature measurement
1小时前
待审核
Ultrafast Photoresponse Using Axial n-ZnO/p-CuO Heterostructure Nanowires Array-Based Photodetectors
2小时前
待审核
Enhancing Performance and Increasing Safety of Concrete Pumps through Digitalization
2小时前
已采纳
Characteristics of double-cascade photodiodes based on p-i-n AlGaAs/GaAs diodes connected by n++-GaAs/i-GaAs/i-AlGaAs/p++-AlGaAs tunnel diodes
2小时前
待审核
Ultra‐Broadband Emission in Bi/Ge Co‐Doped Silica Glass and Fiber via Bismuth Coordination Engineering
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