Lv7
4280 积分 2025-08-13 加入
Multifaceted nature of defect tolerance in halide perovskites and emerging semiconductors
12小时前
已完结
Chromatic confocal measurement method using a phase Fresnel zone plate
2个月前
已完结
Full-field x-ray fluorescence imaging using a Fresnel zone plate coded aperture
2个月前
已完结
Hard X-ray helical dichroism of disordered molecular media
2个月前
已完结
Solar-Blind UV and NIR Bipolar Photodiode for 10 69 Key Space Optical Encryption
2个月前
已关闭
A mass transfer technology for high-density two-dimensional device integration
2个月前
已完结
Cryo–electron microscopy structures of human cone visual pigments
2个月前
已完结
Electrochromic hyperspectral embedding for ultracompact intelligent vision
3个月前
已完结
High-sensitivity mid-infrared photodetection enabled by photothermoelectric effect in PbSe nanosheets
4个月前
已完结
Chemical Vapor Deposited Thin Palladium Sulfide Crystals for Highly Photoresponsive Photodetector
4个月前
已完结
Preparation and characterization of photothermal response bilayer hydrogels for stable information storage and encryption
1年前
已采纳
Multi-stage portfolio optimization for GenCo considering multi-correlation between electricity and carbon markets
1年前
已采纳
Experimental study on curved flame characteristics under longitudinal ventilation in a subway tunnel
1年前
已采纳
TCAD Simulation on Saddle-Fin Device Performance Boosting with Word Line Engineering
1年前
已采纳
Warpage and Stress Analysis in Molded 2.5D Package Chiplet Integration
1年前
已采纳
A model of the axial plume temperature profile of rectangular pool fires dominated by convection under different atmospheric pressures and aspect ratios
1年前
已采纳
Multi‐State Chiral Switching Through Adiabaticity Control in Encircling Exceptional Points
1年前
已采纳
Ultra-S table Mems Clock with 53 Parts-Per-Trillion Fractional Frequency Stability at 8 Hours
1年前
已采纳
Reliability Assessment of Latest SiC Chip and Packaging Technology
1年前
已采纳
Reliability Assessment of Latest SiC Chip and Packaging Technology
1年前
已撤回
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