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58 积分 2025-09-10 加入
Monolithic integration of silicon CMOS and GaN transistors in a current mirror circuit
2个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
2个月前
已完结
Heat transfer characteristics of GaN-substrate heterointerface in GaN HEMT devices: Analysis and regulation strategies
2个月前
已关闭
Experimental and numerical investigation of pressure drop and heat transfer coefficient in convergingdiverging microchannel heat sink
3个月前
已完结
A numerical and experimental investigation of heat transfer and fluid flow characteristics of a cross-connected alternating converging–diverging channel heat sink
3个月前
已完结
Analysis of a parallel microchannel heat sink with tailored flow maldistribution under non-uniform heat sources
4个月前
已关闭
Analysis of a parallel microchannel heat sink with tailored flow maldistribution under non-uniform heat sources
4个月前
已关闭
Integrated embedded cooling method for thermal management in multilayer ceramic circuit substrate microsystems for multi-chip components
5个月前
已完结
Multi-physical field coupling effect in micro pin-fin channel cooling with coaxial-like through-silicon via (TSV) for three-dimensional integrated chip (3D-IC)
6个月前
已关闭
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