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58 积分 2025-09-10 加入
Embedded Microfluidic Cooling with Energetic Electrolytes for the GaN Device: A Feasibility and Adaptability Investigation
1个月前
已完结
Synergistic Thermal Enhancement of Embedded Micro-Pyramid Array and Advanced Nanofluids for High Heat Dissipation
3个月前
已完结
Monolithic integration of silicon CMOS and GaN transistors in a current mirror circuit
6个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
6个月前
已完结
Heat transfer characteristics of GaN-substrate heterointerface in GaN HEMT devices: Analysis and regulation strategies
6个月前
已关闭
Experimental and numerical investigation of pressure drop and heat transfer coefficient in convergingdiverging microchannel heat sink
7个月前
已完结
A numerical and experimental investigation of heat transfer and fluid flow characteristics of a cross-connected alternating converging–diverging channel heat sink
7个月前
已完结
Analysis of a parallel microchannel heat sink with tailored flow maldistribution under non-uniform heat sources
8个月前
已关闭
Analysis of a parallel microchannel heat sink with tailored flow maldistribution under non-uniform heat sources
8个月前
已关闭
Integrated embedded cooling method for thermal management in multilayer ceramic circuit substrate microsystems for multi-chip components
9个月前
已完结
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