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50 积分 2025-10-16 加入
High-Thermal-Conductivity Die Attach Film (DAF) Technologies for Conventional Semiconductor Packaging
10天前
已关闭
Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review
10天前
已完结
Impact of underfill materials on the thermal shock reliability of BGA packages in automotive electronics
10天前
已完结
Metabolic Engineering of Yarrowia lipolytica with Massive Gene Assembly and Genomic Integration
11天前
已完结
Therapeutic potential of Rosa rugosa polysaccharide and its nanofiber membrane in psoriasis via PI3K-AKT/mTOR pathway inhibition
2个月前
已完结
Antiaging effect of Curcuma longa L. essential oil on ultraviolet-irradiated skin
2个月前
已完结
Wideband Push-Pull Class E Amplifier for RF Power Delivery
7个月前
已完结
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