Lv1
28 积分 2026-08-14 加入
Supervised machine learning models for accurate prediction of CBGA solder joint lifespan
1天前
已完结
Stress analysis and structural optimization of 3-D IC package based on the Taguchi method
1个月前
已完结
Optimization of Design Parameters Using Taguchi Method for Thermal Stress Analysis in a 3D IC
1个月前
已完结
Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm
1个月前
已完结
皖公网安备34019202002308
