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10 积分 2026-07-23 加入
Influence of crystal orientation and incident plane on n-type 4H-SiC wafer slicing by using picosecond laser
7小时前
已完结
Crack propagation mechanisms in laser slicing of 4° off-axis 4H-SiC and separation strength regulation via multi-beam processing
9小时前
已完结
Laser slicing of a diamond at the {100} plane using an irradiation sequence that restricts crack propagation along the {111} plane
2天前
已完结
皮秒激光加工CVD单晶金刚石的特征和机理研究
2天前
已完结
Ultrasonic-assisted stripping of single-crystal SiC after laser modification
2天前
已完结
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