Lv11
2 积分 2026-05-29 加入
A novel double-sided cooling packaging structure of SiC-based half bridge module integrating the laminated busbar
1小时前
已完结
Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
1小时前
已完结
Vertically Stacked, Flip-Chip Wide Bandgap MOSFET Co-Optimized for Reliability and Switching Performance
3天前
已完结
3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices
3天前
已完结
Packaging and integration of silicon carbide power devices
3天前
已完结
Packaging Technologies for Single-Side Cooling SiC Power Modules With Low Parasitic Inductance: A Review
3天前
已完结
A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure
8天前
已完结
Power-Hardware-in-the-Loop Electric Motor Emulation for Transportation Electrification Considering Mass Production Variations
1个月前
已完结
Improving Dynamic Accuracy of the Electric Motor Emulator at High Speed via MIMO Design Method
1个月前
已完结
A Neural-Network-Based Electric Machine Emulator Using Neuro-Fuzzy Controller for Power-Hardware-in-the-Loop Testing
1个月前
已完结
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