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88 积分 2026-03-13 加入
Temperature dependence of transport and trapping properties of oxide-nitride-oxide dielectric films
1天前
待确认
Characterization of AuSn Solder in Laser Die Attachment for Photonic Packaging Applications
2个月前
已完结
The AuSn phase diagram
3个月前
已完结
Packaging and integration of silicon carbide power devices
3个月前
已完结
Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy
3个月前
已完结
Modeling, design, and fabrication of ultra-high bandwidth 3D Glass Photonics (3DGP) in glass interposers
3个月前
已完结
Electronic-Photonic Co-Optimization of Linear Drive Laser-Forwarded Coherent Silicon Photonic Transmitters for Co-Packaged Optical (CPO) Links
3个月前
已完结
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
3个月前
已完结
Stress, Thermal and Optical Performance (STOP) Analysis of Co-Packaged Optical Processor with FPGA-Memory-Opticspower Integration
3个月前
已关闭
Passively Aligned Glass Micro-Optic Bridge for Expanded-Beam Vertical Coupling and Pluggable Silicon Photonics
4个月前
已完结
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