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18 积分 2024-04-10 加入
Anisotropic viscoelastic properties of prepreg and their influence on warpage of thin PCB substrates
1个月前
已完结
Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation
1年前
已完结
Warpage Prediction Improvements for Thin Package-on-Package Architectures
1年前
已完结
Warpage Analysis of Multilayer Thin Film/Substrate Systems Using the Eigenstrain Method
1年前
已完结
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