Lv31
212 积分 2026-09-23 加入
Thermally Conductive Yield‐Stress Fluids with Reversible Solid–Liquid Transition Used as Thermal Interface Materials for Heat Dissipation of Chips
11天前
已完结
Colossal Barocaloric Effect in Encapsulated Solid‐Liquid Phase Change Materials
11天前
已完结
Multifunctional Flexible Phase Change Composites With High Thermal Conductivity and Electromagnetic Interference Shielding
20天前
已完结
Nano‐Scale Phonon Dynamics in GaN: Fundamentals and Strategies for Thermal Transport Modulation
25天前
已完结
A discrete unified gas kinetic scheme for phonon Boltzmann transport equation accounting for phonon dispersion and polarization
27天前
已完结
Horizontal-up microfluidics for embedded chip cooling with a dielectric fluid
27天前
已完结
Carpentry-inspired interfaces for improved electronic and thermal transport
1个月前
已完结
Solid-state cooling: thermoelectrics
1个月前
已完结
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