Lv5
978 积分 2021-11-20 加入
Bioinspired thermally conducting packaging for heat management of high performance electronic chips
57分钟前
待确认
Enhancing thermal conductance between graphene and epoxy interfaces through non-covalent cation-π interactions
2天前
已完结
Rational design of covalent-noncovalent coupled interface structures via vacuum-assisted self-assembly/ice-templating dual processes for high thermal conductive composites
22天前
已完结
Hybrid filler-based thermal interface materials: heat transfer mechanisms and AI-guided predictive design
22天前
已完结
Test Models for Stability/Security Studies of AC-DC Hybrid Power Systems With High Penetration of Renewables
22天前
已完结
Significant ballistic thermal transport across graphene layers: Effect of nanoholes and lithium intercalation
24天前
已完结
Thermal Conductivity Enhancement of Graphene/Epoxy Nanocomposites by Reducing Interfacial Thermal Resistance
24天前
已完结
A computational and experimental investigation of TEOS-treated graphene oxide-PVA interaction: Molecular dynamics simulation and COSMO-RS insights
24天前
已完结
Flexible and densified graphene/waterborne polyurethane composite film with thermal conducting property for high performance electromagnetic interference shielding
24天前
已完结
Highly through-plane thermally conductive graphene materials via multi-flow casting
24天前
已完结
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