Lv6
2960 积分 2023-10-02 加入
Macro‐ and Nano‐Porous 3D‐Hierarchical Carbon Lattices for Extraordinarily High Capacitance Supercapacitors
23天前
已完结
Dispersion control in a self-reducible copper hybrid paste for low-temperature formation of conductive copper films
1个月前
已完结
Carbon-based electrocatalysts for sustainable energy applications
1个月前
已完结
Oxidation-resistant bimodal copper interconnects on LCP substrates via in-situ chemically-assisted nano-soldering
1个月前
已完结
Thermal aging-induced interdiffusion and reliability degradation in low-silver electrodes for SHJ solar cells
1个月前
已完结
Copper nanoparticle sintering technology for power electronics packaging-preparation, process, and performance
1个月前
已完结
Low-temperature sinterable copper paste with a flake-spherical hybrid network and enhanced anti-oxidation properties
2个月前
已完结
A molecular pathway to corrosion-resistant printable copper
2个月前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
3个月前
已完结
Super-nano domains enable strength-conductivity synergy in copper foils
3个月前
已完结
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