Lv1
90 积分 2023-04-15 加入
Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
8个月前
已完结
Surface atom migration-involved two-dimensional nucleation and growth of nanotwinned copper in DC electrodeposition
8个月前
已完结
Twin Boundary and Grain Boundary Engineering to Enhance Mechanical Strength of Nanotwinned Cu
8个月前
已完结
Surface atom migration-involved two-dimensional nucleation and growth of nanotwinned copper in DC electrodeposition
8个月前
已完结
Metastable Nanocrystalline Copper for Effective Copper-to-Copper Bonding
9个月前
已完结
Metastable Nanocrystalline Copper for Effective Copper-to-Copper Bonding
9个月前
已完结
Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding
9个月前
已完结
Atomistic behavior of Cu–Cu solid-state bonding in polycrystalline Cu with high-density boundaries
9个月前
已完结
Nonconventional Luminophores: Emission Mechanism, Regulation, and Applications
9个月前
已完结
Advanced Anti‐Counterfeiting: Integrating Humidity‐Responsive Room‐Temperature Phosphorescence and Chromism in Biomass Supramolecular Frameworks
9个月前
已完结
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