Lv21
140 积分 2025-08-12 加入
Reliability improvement of pad-extended on chip light-emitting diodes using an ultra-thin passivation layer
4个月前
已完结
Enhanced light scattering effect of wrinkled transparent conductive ITO thin film
6个月前
已关闭
Effects of the optical absorption of a LED chip on the LED package
6个月前
已完结
Improving the External Quantum Efficiency of High-Power GaN-Based Flip-Chip LEDs by Using Sidewall Composite Reflective Micro Structure
6个月前
已完结
Packaging design for improving the uniformity of Chip scale package (CSP) LED luminescence
6个月前
已完结
High-Performance Green Flip-Chip LEDs with Double-Layer Electrode and Hybrid Reflector
8个月前
已关闭
Electro-Static Failure Evolution of GaN-Based LED Thin Film Chip with Ag Mirrors
8个月前
已关闭
Amorphous/microcrystalline transition of thick silicon film deposited by PECVD
8个月前
已完结
High-Performance Green Flip-Chip LEDs with Double-Layer Electrode and Hybrid Reflector
8个月前
已完结
High Efficiency and ESD of GaN-Based LEDs With Patterned Ion-Damaged Current Blocking Layer
8个月前
已完结
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