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70 积分 2025-08-12 加入
A receiving tape etching scheme for high-yield bonding after direct laser mass transfer process of micro-LEDs
1个月前
已关闭
Effect of surface preparation and interfacial layer on the quality of SiO2/GaN interfaces
1个月前
已完结
Characteristics of RF reactive sputter-deposited Pt/SiO2/n-InGaN MOS Schottky diodes
1个月前
已完结
Promoted Current Injection in GaInN/GaN Multi‐Quantum Nanowire‐Based LEDs Coated With AZO Using Atomic Layer Deposition
3个月前
已完结
Study of a GaN/InGaN-based Light Emitting Diode with an Indium Gallium Oxide Current Blocking Layer, Silver Nanoparticles, and a Gallium Oxide Surface Passivation Layer
3个月前
已完结
Use of a patterned current blocking layer to enhance the light output power of InGaN-based light-emitting diodes
3个月前
已完结
The current induced mass transformation of Ag alloy wire bonded led chip
3个月前
已完结
Improving the performance of power GaN-based thin-film flip-chip LEDs through a twofold roughened surface
3个月前
已完结
Reliability improvement of pad-extended on chip light-emitting diodes using an ultra-thin passivation layer
9个月前
已完结
Enhanced light scattering effect of wrinkled transparent conductive ITO thin film
11个月前
已关闭
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