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250 积分 2025-04-25 加入
Influence of doping Si 3 N 4 nanoparticles on the properties and microstructure of Sn58Bi solder for connecting Cu substrate
5天前
已完结
Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles
16天前
已完结
Study on the interfacial evolution and mechanical properties of Cu/SAC105/Cu solder joint modified by Si3N4 nanowires
16天前
已完结
Performance transformation of Co-added Sn58Bi solder joints under thermal shock conditions for interconnection packaging
16天前
已完结
Effect of horizontal magnetic field on the microstructure and mechanical properties of Ti nanoparticles-reinforced Sn1.0Ag0.5Cu solder: Experimental and first-principles calculations
16天前
已完结
Microstructural transformation and thermo-mechanical improvement of quinary Bi–Sn–In–Ga–Zn solder bumps on a flexible PET substrate
24天前
已完结
Interface microstructures in the wetting of Cu by equiatomic GaInSnBiZn high-entropy alloy
24天前
已完结
An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles
24天前
已完结
An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles
24天前
已完结
Interfacial reaction between novel high entropy alloy SnPbInBiSb and Cu substrate
24天前
已完结
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