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172 积分 2025-04-25 加入
Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles
4天前
已完结
Study on the interfacial evolution and mechanical properties of Cu/SAC105/Cu solder joint modified by Si3N4 nanowires
4天前
已完结
Performance transformation of Co-added Sn58Bi solder joints under thermal shock conditions for interconnection packaging
4天前
已完结
Effect of horizontal magnetic field on the microstructure and mechanical properties of Ti nanoparticles-reinforced Sn1.0Ag0.5Cu solder: Experimental and first-principles calculations
4天前
已完结
Microstructural transformation and thermo-mechanical improvement of quinary Bi–Sn–In–Ga–Zn solder bumps on a flexible PET substrate
12天前
已完结
Interface microstructures in the wetting of Cu by equiatomic GaInSnBiZn high-entropy alloy
12天前
已完结
An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles
12天前
已完结
An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles
12天前
已完结
Interfacial reaction between novel high entropy alloy SnPbInBiSb and Cu substrate
12天前
已完结
SnPbInBiSb high-entropy solder joints with inhibited interfacial IMC growth and high shear strength
12天前
已完结
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