Lv41
506 积分 2025-04-25 加入
Fabrication of Sn-3.5Ag Eutectic Alloy Powder by Annealing Sub-Micrometer Sn@Ag Powder Prepared by Citric Acid-Assisted Ag Immersion Plating
1小时前
已完结
Effects of addition participation in the interfacial reaction on the growth patterns of Cu6Sn5-based IMCs during reflow process
24天前
已完结
Additives effects on growth pattern modification of Cu6Sn5-based intermetallic compounds during reflow process
24天前
已完结
Interfacial IMC evolution and mechanical performance of In-doped Sn58Bi solder joints subjected to isothermal aging
27天前
已完结
Designing Nanoporous Non-noble High Entropy Alloys as Efficient Catalysts for the Hydrogen Evolution Reaction
1个月前
已完结
Mo-Doped FeCoNiCu High-Entropy Alloys with Lattice Oxygen Activation for Stable Oxygen Evolution
1个月前
已完结
TiSi2-modified Ag-Cu-Ti composite filler with enhanced mechanical properties and improved microstructure in Si3N4 ceramic and copper joints
2个月前
已关闭
Dendrites fragmentation induced by oscillating cavitation bubbles in ultrasound field
3个月前
已完结
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder
4个月前
已完结
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints
4个月前
已完结
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