Lv5
1382 积分 2024-05-13 加入
Thermal Transport across Ion-Cut Monocrystalline β-Ga2O3 Thin Films and Bonded β-Ga2O3–SiC Interfaces
10天前
已完结
High Ambipolar Mobility and Long-Range Carrier Transport in Violet Phosphorus Nanosheet
2个月前
已完结
Depressing of Cu Cu bonding temperature by composting Cu nanoparticle paste with Ag nanoparticles
3个月前
已完结
Modeling of Copper Hybrid Bonding Anneal
3个月前
已完结
Multi-Functional Self-Assembled Monolayer for Chip-to-Chip and Chip-to-Wafer Hybrid Bonding
3个月前
已完结
Cu Damascene Process on Temporary Bonded Wafers for Thin Chip Stacking using Cu-Cu Hybrid Bonding
3个月前
已完结
A Novel Polymer-Based Ultra-High Density Bonding Interconnection
3个月前
已完结
A Novel Photosensitive Polyimide Adhesive Material for Hybrid Bonding Processing
3个月前
已完结
Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices
3个月前
已关闭
Reliability Assessment of 2.5D Module using Chip to Wafer Hybrid Bonding
3个月前
已完结
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