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56 积分 2025-07-03 加入
Surface modification of polyimide films by an ethylenediamine treatment for a flexible copper clad laminate
1个月前
已完结
Electrochemical double-pulse technique to modulate the roughened surface of copper foil for copper-clad laminates
1个月前
已完结
Ultra-high flatness and conductivity of copper electrodeposits obtained by nano-twinned/fine-grained double layer electrodeposition
1个月前
已完结
Development of Cost-Effective Ni-Less Surface Finishing Process for High-Speed PCBs
1个月前
已完结
Enhancing the high-frequency signal performance through surface morphological modification of Cu interconnects
1个月前
已完结
Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification
1个月前
已完结
Preventing Anode Degradation Through Copper Foil Surface Modification Techniques for Lithium-Ion Batteries
1个月前
已完结
Effects of Ti Cathode Roughness and Current Density on the Microstructure and Properties of Electrodeposited Copper Foils
1个月前
已完结
Dependence of microstructure and mechanical properties of electrodeposited copper foils on electrochemical behavior of sodium saccharin
1个月前
已完结
Microstructural regulation and performance optimization of Ti3C2Tx-reinforced electrodeposited copper foils
1个月前
已完结
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