Lv22
108 积分 2025-07-03 加入
Microstructural regulation and performance optimization of Ti3C2Tx-reinforced electrodeposited copper foils
4小时前
待确认
Manufacture of Copper Foils for the Current Collector of Lithium-Ion Batteries By Electrochemical Deposition
12小时前
已关闭
Electrodeposition of 15 μm nanotwinned Cu foils with low warpage and excellent mechanical properties
7天前
已完结
The impact of gelatin on the electrodeposition behavior and microstructure of copper in industrial electrolyte solutions
11天前
已完结
Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
12天前
已完结
Incorporation of Tin on copper clad laminate to increase the interface adhesion for signal loss reduction of high-frequency PCB lamination
18天前
已完结
Study on the corrosion resistance of new reticulated organic polymerized film on copper foil surface
20天前
已完结
Review—Principles and Applications of Electrochemical Polishing
23天前
已完结
Super-nano domains enable strength-conductivity synergy in copper foils
1个月前
已完结
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