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1060 积分 2026-07-06 加入
Thermal Management Challenges in 2.5D and 3D Chiplet Integration: A Review on Architecture–Cooling Co-Design
2天前
已完结
Development of the Leg Structure with Concentrated Liquid-Cooling Actuators for Long-Term Operation
1个月前
已完结
Biomimetic Intelligent Thermal Management Materials: From Nature‐Inspired Design to Machine‐Learning‐Driven Discovery
2个月前
已完结
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