Lv3
325 积分 2022-06-15 加入
Heat-assisted pulsed laser processing induced nano-cracks for low kerf-loss and high-surface quality SiC wafer slicing
1个月前
已完结
Modeling of Laser Absorption and Modification Layer Formation Within Silicon Due to Stealth Dicing
7个月前
已完结
Laser slicing of 4H-SiC wafers based on picosecond laser-induced micro-explosion via multiphoton processes
7个月前
已完结
Characterization analysis of 355 nm pulsed laser cutting of 6H-SiC
7个月前
已完结
Stress and crack dynamics in nanosecond laser slicing of silicon carbide
7个月前
已关闭
Crack control for efficient nanosecond-laser slicing of large-size 4H-SiC crystals
7个月前
已完结
Laser ablation and stealth dicing of full-thickness silicon wafer
7个月前
已完结
Effect of 4H-N type conductive SiC 11 2 ̄ 0 wafer anisotropy on the dicing section quality in laser induced thermal-crack propagation
7个月前
已完结
Modulation of ultrafast laser-induced modified structure inside silicon carbide for thin wafer dicing
7个月前
已完结
Dual-stage temporal laser stealth dicing of silicon carbide wafers with continuous crack propagation
7个月前
已完结
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