Lv31
380 积分 2025-09-26 加入
Horizontal-up microfluidics for embedded chip cooling with a dielectric fluid
13天前
已完结
Imaging hidden objects with consumer LiDAR via motion-induced sampling
5个月前
已完结
Advancing cooling limits with 3D embedded microchannels
11个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
11个月前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
1年前
已完结
皖公网安备34019202002308
