Lv4
740 积分 2024-04-12 加入
Enhanced thermal conductivity in Cu/diamond composites by tailoring the thickness of interfacial TiC layer
17天前
已完结
The structure and thermal conductivity of the diffusion-bonded interface of diamond-copper composite material prepared by spark-plasma sintering based on a molybdenum interlayer
17天前
已完结
Achieving excellent wetting of inactive Ag on C/C composites by a low-temperature surface modification strategy
1个月前
已完结
In‐situ synthesis of TiC nanoparticles during joining of SiC ceramic and GH99 superalloy
3个月前
已完结
Phase separation and its relationship with thermoelectric properties in tin-substituted magnesium silicide synthesized from melt
3个月前
已完结
Quartet structure generation set algorithm based 3D reconstruction on porous structures of sintered copper joints for power electronics packaging
3个月前
已关闭
Evolution of interfacial intermetallic layers in steel-aluminum joints: Thermodynamic and adhesion perspectives
3个月前
已关闭
Suppression of interfacial IMCs spallation in Ni-P/SAC305 joints via barrier layer morphology control
4个月前
已完结
Improving the bonding strength of copper/steel joint in the laser lap welding by applying rolling force
4个月前
已关闭
Joining Si3N4 ceramic to Invar using Mo mesh and Cu foil interlayer
4个月前
已完结
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