Lv51
1100 积分 2024-09-20 加入
TSiCV Based Silicon Carbide Interposer Technology
2个月前
已完结
Optimized TIM1 Solution for Large 2.5D HPC Packages Using Silicone Matrix Containing Liquid Metal Materials
3个月前
已完结
An Energy-efficient Si-integrated Micro-cooler for High Power and Power-density Computing Applications
4个月前
已完结
X64 UCIe Chiplet Interconnection at 32 GT/s on a Silicon Core Substrate
4个月前
已完结
Effective Build-Up Substrate Design for Warpage Reduction and Reliability Enhancement in Advanced Semiconductor Packages
4个月前
已完结
High-Speed Packages for the Chiplet Era
4个月前
已完结
Enabling 20 Tb/s/mm Die-to-Die Bandwidth Density with Advanced Packaging Technologies
4个月前
已完结
6.4Tbps, 224Gbps/Lane Co-Packaged Optical Engines With Fine Pitch Through-Package Interconnects: Powering AI/ML and Next-Gen Data Centers
4个月前
已完结
SoW-X: A Novel System-on-Wafer Technology for Next Generation AI Server Application
4个月前
已完结
Impedance Corrected De-Embedding
6个月前
已完结
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