Lv5
980 积分 2024-09-20 加入
Optical RDL Interposer Technology using Polymeric Hybrid Bonding and Waveguide for Integrated CPO
6天前
已完结
Advancing Interconnect Performance and Reliability with Innovations in 3D Photonic Integration Packaging and Fiber Coupling
7天前
已完结
Photonic Fabric™ Chiplets for Co-Packaged Optics in AI Data Centers
7天前
已完结
Direct to Silicon Microfluidic Cooling for Datacenters
7天前
已完结
Photonic Fabric™ Interconnect for a Scale-up Network Solution in Accelerated Computing
7天前
已完结
Development of Long-term Reliability for Glass Core Substrates with Build-up layers
7天前
已完结
Glass Core Substrates – Next Generation Advanced Packaging Platform for AI and HPC
7天前
已完结
Optical Engine (OE) Integration Challenges for Next-Generation CPO on Networking and HPC Application
11天前
已完结
Integrated Assembly Process For Pluggable Fiber Connector For Co-Packaged Optics
11天前
已完结
Development of a High-Efficiency, Wide-Temperature-Range Optical Coupling Structure for CPO Modules
11天前
已完结
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