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40 积分 2025-07-11 加入
Formation and microstructural characterization of In2O3 sheath layer on InN nanostructures
26天前
已完结
Fabrication of high-aspect-ratio 5 μm ultra-small pitch indium bump arrays by vacuum thermal deposition under variable rate
8个月前
已完结
Large Format CMOS Imager Integration Utilizing an Indium Bonding Process and Buried ARC Reveal
8个月前
已完结
Thermal expansion of AuIn2
1年前
已完结
Underfill Flow in Flip-Chip Encapsulation Process: A Review
1年前
已完结
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
1年前
已完结
Analysis of underfill technology for large-scale IRFPA devices
1年前
已完结
Recent Advances in Flip-Chip Underfill: Materials, Process, and Reliability
1年前
已完结
Recent advances in modeling the underfill process in flip-chip packaging
1年前
已关闭
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