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26 积分 2025-05-18 加入
Design and intelligent optimization of TSV-based embedded microchannel heatsinks in 2.5D Packaging
2小时前
待确认
Integrated manifold microchannels and near-junction cooling for enhanced thermal management in 3D heterogeneous packaging technology
3小时前
已完结
An optical fiber chlorogenic acid sensor using a Chitosan membrane coated bent optical fiber probe
1年前
已完结