Lv1
70 积分 2026-03-11 加入
Improving bending property of copper foil by the combination of double-rolling and cross rolling
2个月前
已完结
Grain boundary motions of low temperature and low pressure copper to copper direct bonding by electroplating ultra-fine-grain (UFG) Cu
2个月前
已完结
Structure–Property Relationship in Ultra-Thin Copper Foils: From Nanotwinned to Fine-Grained Microstructures
2个月前
已完结
Microstructure dependence of strength and elongation of electrodeposited Cu foils
2个月前
已完结
Texture and Flexural Fatigue Resistance Governed by Surface-Dependent Deformation and Recrystallization in the Copper Foils
2个月前
已完结
Grain control and property regulation of electrolytic copper foils with ethylene thiourea additive
2个月前
已完结
Research on the optimization of microstructure and enhancement of properties in ultra-thin electrolytic copper foil by rare-earth ions Ce3+ and La3+ additions
2个月前
已完结
Quantifying synergistic interactions of ternary additives for microstructural control in ultrathin Li-ion battery copper foils
2个月前
已完结
Bimodal grain size distribution achieving high strength and ductility in electrodeposited copper foil
2个月前
已关闭
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