Lv4
446 积分 2026-04-18 加入
A PCB-like process for vertically configured thermopiles
3个月前
已完结
Recent advances in energy field assisted hybrid electrodeposition and electroforming processes
3个月前
已完结
Review of Cu–Cu direct bonding technology in advanced packaging
3个月前
已完结
Effect of bonding interfacial microstructures on the properties and reliabilities of Cu–Cu joints
4个月前
已完结
Review of Cu–Cu direct bonding technology in advanced packaging
4个月前
已完结
Electrodeposition of nanocrystalline Cu for Cu-Cu direct bonding
4个月前
已完结
Electric field-assisted soldering of glass and copper with Zn-10Al-12Sn solder
4个月前
已完结
Interfacial bonding mechanisms in ultrasonic-assisted soldered Si/Cu joint using Sn-3.5Ag-4Al solder
4个月前
已完结
Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology
4个月前
已完结
Challenges and prospects for advanced packaging
4个月前
已完结
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