Lv11
68 积分 2022-03-22 加入
Development of photosensitive solder resist with high reliability for semiconductor package
4小时前
已完结
Development of Solder Resist with Improved Adhesion at HTSL (175 deg C for 3000 Hours) and Crack Resistance at TST for Automotive IC Package
5小时前
已完结
Synthesis and Characterization of Acrylic Acid Modified o-Cresol Formaldehyde Epoxy Resin
9个月前
已关闭
Synthesis and characterization of acrylic acid modified o-cresol formaldehyde epoxy resin-all databases
9个月前
已完结
Waterborne Epoxy/Acrylic Resins Stabilized through the Neutralization of Basic Amine-Modified Epoxy and Acidic Acrylic Copolymers
9个月前
已完结
Research Progress of Waterborne UV Resin
9个月前
已完结
Progress of bio-based coatings in waterborne system: Synthesis routes and monomers from renewable resources
9个月前
已完结
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