| 标题 |
Development of Solder Resist with Improved Adhesion at HTSL (175 deg C for 3000 Hours) and Crack Resistance at TST for Automotive IC Package |
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| DOI | |
| 其它 |
期刊:2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 作者:Chiho Ueta; Kazuya Okada; Toko Shiina; Tadahiko Hanada; Nobuhito Ito 出版日期:2017-08-04 |
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(2025-6-4)