Lv1
54 积分 2023-06-02 加入
High-modulus oriented thermal interface materials with low thermal contact resistance for efficient thermal management
8小时前
已关闭
Insight into Interfacial Heat Transfer of β-Ga2O3/Diamond Heterostructures via the Machine Learning Potential
10小时前
已完结
Alternating layer-by-layer assembly of cellulose-based composite films via structural design and interfacial engineering for high thermal conductivity
7天前
已关闭
Physics-informed neural networks in heat transfer-dominated multiphysics systems: A comprehensive review
15天前
已完结
Enhanced heat conduction in diamond/copper composites via interconnected structures: Machine learning molecular dynamics simulation
1个月前
已完结
Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features
1个月前
已完结
Exploring thermal interface materials for electronics via molecular dynamics simulations: A review
1个月前
已完结
Improving the Thermal Performance of Liquid Metal Thermal Interface Materials: The Role of Intermetallic Compounds at the Gallium/Copper Interface
1个月前
已完结
A bottom-up approach to generate isotropic liquid metal network in polymer-enabled 3D thermal management
1个月前
已完结
A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction
1个月前
已完结