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26 积分 2023-06-02 加入
Advancing cooling limits with 3D embedded microchannels
5天前
已完结
Jet-enhanced manifold microchannels for cooling electronics up to a heat flux of 3,000 W cm−2
5天前
已完结
Optimal structural analysis of spiral microchannel based on chip heat dissipation
5天前
已关闭
Co-designing electronics with microfluidics for more sustainable cooling
9天前
已完结
Multiscale thermal analysis of diamond/Cu composites for thermal management applications by combining lattice Boltzmann and finite element methods
23天前
已关闭
Hybrid lattice Boltzmann 3D simulation of combined heat transfer by conduction, convection and radiation
23天前
已关闭
Coupling Mesoscopic Boltzmann Transport Equation and Macroscopic Heat Diffusion Equation for Multiscale Phonon Heat Conduction
23天前
已完结
Evaluation and optimization on heat transfer performance of a composite phase change material embedded in porous ceramic skeleton: A lattice Boltzmann study
26天前
已完结
Development of a thermal lattice Boltzmann method to simulate heat transfer problems with variable thermal conductivity
26天前
已完结
Multifunctional Liquid Metal–2D Material Composites: Structural Design, Properties, and Applications in Advanced Electronics
29天前
已完结
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