Lv5
1010 积分 2026-05-19 加入
Cornerstone of Next-Generation 3D Integration: Structures, Processes, and Applications of TGV
1天前
已完结
Co-packaged optics for high-performance computing and artificial intelligence
22天前
已完结
Co-packaged optics for high-performance computing and artificial intelligence
1个月前
已完结
Co-W alloy as an effective barrier layer for suppressing Sn surface diffusion and sidewall IMCs in small-size micro-bumps
3个月前
已完结
Impact on Reliability of Microvoids and β-Sn Anisotropy in Flip-Chip Bumps
3个月前
已完结
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits
3个月前
已完结
Ultrasound-on-chip platform for medical imaging, analysis, and collective intelligence
4个月前
已关闭
Optical Packaging/Module Technologies
4个月前
已完结
Transceivers, Packaging, and Photonic Integration
4个月前
已关闭
Flexible and Wearable Ultrasound Device for Medical Applications: A Review on Materials, Structural Designs, and Current Challenges
4个月前
已完结
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