Lv6
2410 积分 2024-07-15 加入
A Study on the Gap-Fill Process Deposited by the Deposition/Etch/Deposition Method in the Space-Divided PE-ALD System
1天前
已完结
Effect of Bias Frequency on Bottom-Up SiO2Gap-Filling Using Plasma-Enhanced Atomic Layer Deposition
1天前
已完结
(Invited) FALP (Fast Atomic Layer Processing) a Chamber for Combined PEALD and ALE Processes
1天前
已关闭
Effect of tensile uniaxial stress on the electron transport properties of deeply scaled FD-SOI n-type MOSFETs
5天前
已完结
Influence of Etching Potential on Convex Corner Anisotropic Etching in TMAH Solution
8天前
已完结
Plasma Etch of IGZO Thin Film and IGZO/SiO2 Interface Diffusion in Inductively Coupled CH4/Ar Plasmas
1个月前
已完结
In situ diagnostics of the Si etching structures profile in ICP SF6/C4F8 plasma: Macrostructures
1个月前
已完结
Cryogenic DRIE processes for high-precision silicon etching in MEMS applications
1个月前
已完结
Formation of Si nanopillars through partial sacrificing in super passivation reactive ion etching
1个月前
已完结
Study of Photo-Resist (PR) Strip Rate with High Temperature Pedestal for AL Patterning Process
2个月前
已完结
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