Lv3
260 积分 2023-03-08 加入
Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels
11小时前
已完结
Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process
11小时前
已完结
Optimization of Laser-induced Deep Etching for TGV Fabrication in Fused Silica
11小时前
已完结
Development of low cost through glass via (TGV) interposer with high-Q inductor and MIM capacitor
11小时前
待确认
CO2-laser drilling of TGVs for glass interposer applications
11小时前
待确认
Slow-Wave Substrate Integrated Waveguide with Low Loss and Miniaturized Dimensions Using TGV Technology
11小时前
已完结
Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging
11小时前
已完结
A New Method of TGVs for Fast Filling of Metal Paste
11小时前
待确认
A Low-Loss Slow Wave SIW Bandpass Filter With Blind via-Holes Using TGV Technology
11小时前
求助中
Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
11小时前
已完结
皖公网安备34019202002308
