Lv3
270 积分 2023-03-08 加入
First-Principles Linear Combination of Atomic Orbitals Calculations of K2SiF6 Crystal: Structural, Electronic, Elastic, Vibrational and Dielectric Properties
9个月前
已完结
Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels
9个月前
已完结
Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process
9个月前
已完结
Optimization of Laser-induced Deep Etching for TGV Fabrication in Fused Silica
9个月前
已完结
Development of low cost through glass via (TGV) interposer with high-Q inductor and MIM capacitor
9个月前
已完结
CO2-laser drilling of TGVs for glass interposer applications
9个月前
已完结
Slow-Wave Substrate Integrated Waveguide with Low Loss and Miniaturized Dimensions Using TGV Technology
9个月前
已完结
Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging
9个月前
已完结
A New Method of TGVs for Fast Filling of Metal Paste
9个月前
已完结
A Low-Loss Slow Wave SIW Bandpass Filter With Blind via-Holes Using TGV Technology
9个月前
已完结
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