Lv21
148 积分 2025-11-20 加入
Wafer-to-Wafer Hybrid Bonding Technology with 200nm Interconnect Pitch
1小时前
求助中
Boron-doped amorphous carbon deposited by DC sputtering for a hardmask: Microstructure and dry etching properties
5天前
已完结
Advances in Flexible Thermoelectric Materials and Devices Fabricated by Magnetron Sputtering
5天前
已完结
Electron Beam Evaporation Deposition
5天前
已完结
Penetration State Identification from Stereo Image Pair of Weld Pool in GMAW Process by Deep Learning
20天前
已完结
Research on the relationship between periodic flow and heat input of inhomogeneous melting of laser cladding molten pool
22天前
已关闭
Si/SiGe heterostructures for Si-based nanoelectronics
1个月前
已关闭
Mechanisms of room-temperature SiCN pre-bonding and low-temperature post-annealing of SiCN/nanocrystalline-nanotwinned Cu hybrid joints
1个月前
已完结
Influence of the PVD sputtering method on structural characteristics of SiCN-coatings — Comparison of RF, DC and HiPIMS sputtering and target configurations
1个月前
已完结
Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure
2个月前
已完结
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