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90 积分 2025-11-20 加入
Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150°C and Atmospheric Pressure
22天前
已完结
SoIC for Low-Temperature, Multi-Layer 3D Memory Integration
22天前
已完结
Metallurgy - Advances in Materials and Processes
23天前
已关闭
Development of multi-stack dielectric wafer bonding
26天前
已完结
Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics
26天前
已完结
Low temperature direct bonding mechanisms of tetraethyl orthosilicate based silicon oxide films deposited by plasma enhanced chemical vapor deposition
27天前
已完结
The Role of Surface Chemistry in Bonding of Standard Silicon Wafers
27天前
已完结
Investigations on hardness of rf sputter deposited SiCN thin films
27天前
已完结
Thermal diffusivity in amorphous silicon carbon nitride thin films by the traveling wave technique
27天前
已完结
Enhancing Structural/Interfacial Stability and Li+ Diffusion Kinetics of LiCoO2 at High Voltage via a Synergetic Strategy
29天前
已完结
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