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Study on the deposition and low-temperature bonding of PVD SiCN thin film
49分钟前
求助中
Investigation of Dielectric Materials in D2W Bonding: SiO2-SiO2, SiO2-SiCN, and SiCN-SiCN
2小时前
已完结
Direct Bonding Using Low Temperature SiCN Dielectrics
2小时前
已完结
Evaluation of PVD SiCN for Cu/SiCN Hybrid Bonding
2小时前
已完结
Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology
2小时前
已完结
Reliability Challenges in Advanced 3D Technologies: The Case of Through Silicon Vias and SiCN–SiCN Wafer-to-Wafer Hybrid-Bonding Technologies
2小时前
已完结
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