Lv4
440 积分 2024-11-23 加入
Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles
18天前
已完结
Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering
18天前
已完结
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding
18天前
已完结
Investigation on Ag-Cu-Sn brazing filler metals
1个月前
已完结
Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field
3个月前
已完结
Effect of ultrasound-assisted soldering on the microstructure and mechanical properties of Cu/Sn58Bi-Foam Co/Cu soldered joints: Experiments and first-principles calculations
4个月前
已完结
Quantifying adhesion energy of mechanical coatings at atomistic scale
9个月前
已完结
Quantifying adhesion energy of mechanical coatings at atomistic scale
9个月前
已完结
Surface energy and adhesion energy of elastic bodies
9个月前
已完结
Rapid Defect Engineering in FeCoNi/FeAl2O4 Hybrid for Enhanced Oxygen Evolution Catalysis: A Pathway to High‐Performance Electrocatalysts
9个月前
已完结
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