Lv41
500 积分 2024-11-23 加入
Shear strength and wettability of active Sn3.5Ag4Ti(Ce,Ga) solder on Al2O3 ceramics
5小时前
求助中
Effect of ultrasonic power on wettability, porosity and mechanical properties of ultrasonic-aided laser reflow soldering
24天前
已完结
Research progress in biohydrometallurgy of rare metals and heavy nonferrous metals with an emphasis on China
2个月前
已完结
Ultrasonic-assisted connection of Cu/Cu structure using Sn58Bi solder enhanced by B4C nanoparticles
2个月前
已完结
Electronic and Photoelectronic Memristors Based on 2D Materials
3个月前
已完结
Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves
3个月前
已完结
Reliability of Sn–Ag–Sb lead-free solder joints
3个月前
已完结
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding
4个月前
已完结
Thermodynamic Modeling of the Bi–Ga–Zn System
4个月前
已关闭
Calorimetric and phase diagram studies of the Ga-In-Zn system
4个月前
已完结
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