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663 积分 2022-12-15 加入
A Novel Model for Copper Electroplating Process Simulation Minimizing Chemical Additives
10天前
已完结
Simulation and experimental study of friction-assisted jet electrodeposition of Cu-Sn binary alloys in small-diameter holes
10天前
已完结
Decoupling PEG and chloride co-adsorption kinetics at copper/electrolyte interface during pattern-dependent electrodeposition
10天前
已完结
Toward Operando Modeling of Electrochemical Processes at Metal-Aqueous Solution Interfaces
10天前
已完结
The effects of polyvinylpyrrolidone molecular weight on defect-free filling of through-glass vias (TGVs)
10天前
已完结
Asymmetric Bidirectional Pulse Electrodeposition Enabling Super-Filling of Through Glass Vias With Large Aperture and High Aspect Ratio
10天前
已完结
Application of the Taguchi method to minimize the non-uniformity of copper deposition in electroplating with numerical model
10天前
已完结
Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application
10天前
已完结
Study on the Action Mechanism of a Nontraditional Thioamide-Based Leveler of 1-Phenyl 2-Thiourea for Microvia Void-Free Filling
10天前
已完结
Accurate conservative phase-field method for simulation of two-phase flows
11天前
已完结
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