Lv3
376 积分 2024-12-19 加入
Driving frequency effect on discharge parameters and higher harmonic generation in capacitive discharges at constant power densities
2天前
已完结
Characteristics of SiO2 etching by using pulse-time modulation in 60 MHz/2 MHz dual-frequency capacitive coupled plasma
4个月前
已完结
Contribution of Ion Energy and Flux on High-Aspect Ratio SiO2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C4F8 Plasma: Individual Ion Energy and Flux Controlled
4个月前
已完结
Control of the discharge chemistry of CHF3 in dual-frequency capacitively coupled plasmas
5个月前
已完结
Contact Edge Roughness In The Etching Of High Aspect Ratio Contacts In Sio2
5个月前
已完结
Investigation of SiO2 Etch Characteristics by C6F6/Ar/O2 Plasmas Generated Using Inductively Coupled Plasma and Capacitively Coupled Plasma
5个月前
已完结
Effect of heavy inert ion strikes on cell density-dependent profile variation and distortion during the etching process for high-aspect ratio features
5个月前
已完结
Contribution of Ion Energy and Flux on High-Aspect Ratio SiO2 Etching Characteristics in a Dual-Frequency Capacitively Coupled Ar/C4F8 Plasma: Individual Ion Energy and Flux Controlled
5个月前
已完结
Voltage waveform tailoring for high aspect ratio plasma etching of SiO2 using Ar/CF4/O2 mixtures: Consequences of ion and electron distributions on etch profiles
5个月前
已完结
Novel 4F2 DRAM cell with Vertical Pillar Transistor(VPT)
5个月前
已完结
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