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38 积分 2024-04-27 加入
Enhanced Jaya optimization in electrical discharge hole making of MoSi2–SiC composite with surface morphology analysis
3个月前
已完结
Effects of grinding speed on the material removal mechanism in single grain grinding of SiCf/SiC ceramic matrix composite
5个月前
已完结
Study on surface/subsurface breakage in ultrasonic assisted grinding of C/SiC composites
10个月前
已完结
Rotary ultrasonic machining of carbon fiber reinforced plastic composites: a study on fiber material removal mechanism through single-grain scratching
11个月前
已完结
Single diamond scribing of SiCf/SiC composite: Force and material removal mechanism study
11个月前
已完结
Investigation of grinding mechanism of a 2D Cf/C–SiC composite by single-grain scratching
11个月前
已完结
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