Lv1
50 积分 2023-09-22 加入
Allowable copper thickness for fine pitch patterns formed by a subtractive method
1天前
待确认
Adhesion strength of electroless copper deposit to epoxy board
1个月前
已完结
Electroless plating of a 5G copper antenna on polyimide patterned with laser-induced selective activation and curing of metal–organic catalyst
5个月前
已完结
Synthesis and Structural Characterization of Two New Charge-Assisted Hydrogen-Bonded Supramolecular Networks in 2-Amino-4-methylpyridinium Isophthalate Dihydrate and 2-Amino-5-methylpyridinium Hydrogen Isophthalate
6个月前
已完结
Highly robust soft-rigid connections via mechanical interlocking for assembling ultra-stretchable displays
6个月前
已完结
Polyimide‐Based Flexible Plasma Sheet and Surface Ionization Waves Propagation
8个月前
已完结
Highly thermally conductive flexible copper clad laminates based on sea-island structured boron nitride/polyimide composites
8个月前
已完结
Photosensitive hybrid polysilsesquioxanes for etching-free processing of flexible copper clad laminate
8个月前
已完结
Metasurface‐Assisted Optical Encryption Carrying Camouflaged Information
1年前
已完结
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