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60 积分 2023-09-22 加入
Recent progress and challenges of photosensitive polyimides in advanced packaging: Technology beyond limit
5个月前
已完结
Photophysics, photochemistry, and optical properties of polyimides
5个月前
已完结
Design and synthesis of epoxy prepolymer containing aromatic imide structures for thermoset with excellent thermal, mechanical and dielectric properties
5个月前
已完结
Novel polyimides with improved adhesion to smooth copper and low coefficient of thermal expansion
5个月前
已完结
Preparation and characterization of metal oxide/polyimide nanocomposites
6个月前
已完结
Photooxidation of Hantzsch 1,4-dihydropyridines by molecular oxygen
6个月前
已完结
Fundamentals of Photoresist Chemistry
6个月前
已完结
High-Resolution Copper Micropatterning on Flexible Substrates via Laser-Assisted Surface Activation
10个月前
已完结
Allowable copper thickness for fine pitch patterns formed by a subtractive method
1年前
已完结
Adhesion strength of electroless copper deposit to epoxy board
1年前
已完结
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