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60 积分 2023-09-22 加入
Recent progress and challenges of photosensitive polyimides in advanced packaging: Technology beyond limit
10天前
已完结
Photophysics, photochemistry, and optical properties of polyimides
27天前
已完结
Design and synthesis of epoxy prepolymer containing aromatic imide structures for thermoset with excellent thermal, mechanical and dielectric properties
29天前
已完结
Novel polyimides with improved adhesion to smooth copper and low coefficient of thermal expansion
29天前
已完结
Preparation and characterization of metal oxide/polyimide nanocomposites
1个月前
已完结
Photooxidation of Hantzsch 1,4-dihydropyridines by molecular oxygen
1个月前
已完结
Fundamentals of Photoresist Chemistry
1个月前
已完结
High-Resolution Copper Micropatterning on Flexible Substrates via Laser-Assisted Surface Activation
5个月前
已完结
Allowable copper thickness for fine pitch patterns formed by a subtractive method
7个月前
已完结
Adhesion strength of electroless copper deposit to epoxy board
9个月前
已完结
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