Lv11
56 积分 2025-11-05 加入
Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging
1小时前
已完结
A Review of Glass Substrate Technologies
2个月前
已完结
Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study
2个月前
已完结
Comprehensive Die Strengths Comparisions for Glass-Core Advanced Packaging Substrates using Different Singulation Methods - Dicing-Induced SeWaRe Failures Revisited Ten Years Later-
7个月前
已完结
The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study
8个月前
已完结
Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates
8个月前
已完结
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