Lv21
112 积分 2025-11-05 加入
Investigation on Warpage Characteristics for Ultralarge MCM FCBGA Package Based on Material-Structure Codesign and Intelligent Optimization
2天前
已完结
Technology for Forming Micro Vias Smaller Than 20 $\mu \mathrm{m}$ with Low Surface Roughness on Build-Up Films Using UV Nanosecond Laser Drilling and Plasma Desmearing
6天前
已完结
Study of Parameter Tuning for the Curing Condition on ABF Type for Large FCBGA Package
6天前
已完结
Study of Parameter Tuning for the Curing Condition on ABF Type for Large FCBGA Package
8天前
已完结
New power delivery network(PDN) approach for extremely large FC-BGA with organic substrate based on over 1mm-thick core
12天前
已完结
From Organic to Glass Core substrates: the journey of IC substrates to enable AI and HPC systems
18天前
已完结
High-throughput microvia drilling in advanced packaging materials using state-of-the-art industrial UV lasers
18天前
已关闭
Laser singulation of IC packages
19天前
已完结
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
2个月前
已完结
CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package
2个月前
已完结
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