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62 积分 2025-11-05 加入
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
29天前
已完结
CoWoS Architecture Evolution for Next Generation HPC on 2.5D System in Package
1个月前
已完结
Mechanical behavior of glass with different roughness and its influence on TGV reliability
1个月前
已完结
Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging
1个月前
已完结
A Review of Glass Substrate Technologies
4个月前
已完结
Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study
4个月前
已完结
Comprehensive Die Strengths Comparisions for Glass-Core Advanced Packaging Substrates using Different Singulation Methods - Dicing-Induced SeWaRe Failures Revisited Ten Years Later-
9个月前
已完结
The effect of materials and design on the reliability of through-glass vias for 2.5 D integrated circuits: a numerical study
10个月前
已完结
Prevention of Cracking From RDL Stress and Dicing Defects in Glass Substrates
10个月前
已完结
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