Lv41
658 积分 2024-10-17 加入
Exploration and mitigation of local wafer deformations resulting from direct wafer-to-wafer bonding
30天前
已完结
A review in thermal management for advanced chip packaging from chip to heat sink
1个月前
已完结
Single-crystalline LiNbO3 integrated onto Si-based substrates via Ar plasma-activated low-temperature direct bonding
2个月前
已完结
Investigations on ion implantation-induced strain in rotated Y-cut LiNbO3 and LiTaO3 *
2个月前
已完结
Defect and crack evolution induced by H+ and He+ implantation during the crystal ion slicing of single-crystal LiTaO3
2个月前
已关闭
Effects of nano-SiO2 on interfacial bond performances between normal-strength concrete and high-strength concrete
2个月前
已关闭
Damage mechanisms of 2.5D SiO2f/SiO2 woven ceramic matrix composites under compressive impact
2个月前
已完结
Flash‐Lamp Annealing for Repairing Residual Defects in Single‐Crystalline LiTaO3‐On‐Silicon Thin Films Fabricated by Crystal Ion Slicing
2个月前
已完结
Enhancing silicon wafer ablation using passive Q-switch 2μm lasers with third-order nonlinear effects
2个月前
已关闭
Enhancing silicon wafer ablation using passive Q-switch 2μm lasers with third-order nonlinear effects
2个月前
已关闭
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