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Research on the Effects of Solder Layer THICKNESS on the Reliability of High Power IGBT Module
2小时前
待确认
Optimization of Reflow Profile for Solder Thermal Interface Materials with an Inline Vacuum Oven
2小时前
已完结
Formation of novel rice-like intermetallic phases and changes in the mechanical, microstructural and electrical properties of Sn–5Sb alloys with addition Ag and Bi
5个月前
已完结
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