| 标题 |
Research on the Effects of Solder Layer THICKNESS on the Reliability of High Power IGBT Module |
| 网址 | |
| DOI | |
| 其它 |
期刊:International Conference on Emerging Technologies 作者:Lei Wu; Yuan Yang; Xiaofei Yang; Haohao Ma; H. Gong; et al 出版日期:2023-05-12 |
| 求助人 | |
| 下载 |
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(2025-6-4)