Lv66
1710 积分 2024-07-02 加入
Ultrathin flexible heat pipes with heat transfer performance and flexibility optimization for flexible electronic devices
1小时前
已完结
Performance study of a biomimetic leaf vein microchannel coupled jet impingement system for high-power chip thermal management
2天前
已完结
Thermal management of data centers: Chip-scale cooling using novel distributed inlet–outlet jet impingement liquid cold plate
3天前
已完结
Experimental investigation of the thermal characteristics of a novel pure-metal-based flexible ultrathin vapour chamber
5天前
已完结
Thermo-hydraulic performance analysis of a staggered-flow Z-type manifold microchannel heat sink for ultra-high heat flux thermal management
6天前
已完结
High-efficient cooling from a counter-flow microchannel heat sink with sinusoidal wave walls for high-performance electronic devices
7天前
已完结
Comprehensive Analysis of Flow-Heat Transfer- Thermodynamics in Convex Ribbed Microchannel Jet Process with Different Convex Ribbed Structures
9天前
已完结
A high capability vapor chamber in thermal management of high power and heat flux chips
9天前
已完结
Comprehensive analysis of flow-heat transfer-thermodynamics in ribbed microchannel jet process with different structures
9天前
已关闭
Surfactant-free Synthesis and Growing Process of One-dimensional Mg–Al Layered Double Hydroxide Nanobelts
皖公网安备34019202002308
