Lv52
990 积分 2024-07-02 加入
Flow Boiling Heat Transfer in a Lotus Leaf-Inspired Microchannel Heat Sink with Enhanced Critical Heat Flux for Large Area Chips
1个月前
已完结
Passive thermal management of electronic devices
2个月前
已完结
Passive thermal management of electronic devices using sorption-based evaporative cooling
2个月前
已完结
Thermal management enhancement of electronic chips based on novel technologies
3个月前
已完结
Experimental Investigation of a Compact Lid-Compatible Multi-jet Impingement Manifold for Direct-On-Chip Cooling
5个月前
已完结
Multi-Physics Coupling in IGBT Modules: A Review
5个月前
已关闭
A Novel Double-sided Cooling 3L-ANPC SiC MOSFET Power Module with Interleaved Layout
5个月前
已关闭
Compact Spatially Symmetric Double-Sided Embedded Packaging Method for Parallel SiC MOSFETs
6个月前
已完结
Conduction Thermal Runaway of SiC MOSFET Under Natural Convection Heat Dissipation
6个月前
已完结
Compact Spatially Symmetric Double-Sided Embedded Packaging Method for Parallel SiC MOSFETs
6个月前
已完结
Surfactant-free Synthesis and Growing Process of One-dimensional Mg–Al Layered Double Hydroxide Nanobelts
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