Lv6
3070 积分 2024-07-02 加入
Frequency-Dependent Internal Gate Resistance of SiC Power MOSFETs
1天前
已完结
Heat transfer and fluid flow analysis of microchannel heat sinks with periodic vertical porous ribs
8天前
已完结
Small channel cold plate flow field and bionic rib structure design for high heat flux electronic devices cooling
8天前
已关闭
Porosity-tunable LPBF copper wicks directly printed on silicon for high-heat-flux cooling: Thermal, mechanical, and reliability characteristics as a function of laser processing conditions
14天前
已关闭
A Novel Double-Layer Manifold Design for Uniform Cooling of Multiple Sic Power Modules
14天前
已完结
Electrochemical additive manufacturing-based cold plate with distributed inlet nozzles and outlet slots for high-power-density electronics cooling
20天前
已完结
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
24天前
已完结
Negative Gate Bias Induced $V_{\mathrm{t}\mathrm{h}}$ Instability in SiC MOSFET: Role of Body Diode Conduction
1个月前
已关闭
Analysis of factors influencing the thermal characteristics of multichip parallel packaging in power devices
1个月前
已完结
Experimental Characterization And Server-Level Demonstration Of Confined, Direct-On-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation
1个月前
已完结
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