Lv75
3890 积分 2024-07-02 加入
Experimental investigations of the effect of sintering pressure and temperature on the porosity and mechanical properties of sintered silver
21天前
已完结
Non-Dewetting Cu@Ag Bimodal Nanoparticle Paste and Low-Temperature Pressureless Sintering for Electronic Packaging
22天前
已完结
Microstructure, Resistivity, and Strength of Pressureless Sintered Silver Joints: Effect of Powder Formulation
22天前
已完结
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications
22天前
已完结
Benefits of .XT Interconnection Technology for 3.3 kV XHP 2 Module with 3.3 kV CoolSiC MOSFET
27天前
已关闭
Detecting Asymmetries Within Multi-Chip SiC Power Modules by Means of the Kelvin Source
28天前
已完结
Novel large area joining technique for improved power device performance
1个月前
已完结
High-efficiency thermal management of variable-load IGBT power modules using microchannel heat sinks and graphite sheet
1个月前
已完结
Measurement and Modeling of Bond Wire Degradation in TO-Packaged SiC MOSFETs
1个月前
已完结
皖公网安备34019202002308
