Lv66
3010 积分 2024-07-02 加入
Heat transfer and fluid flow analysis of microchannel heat sinks with periodic vertical porous ribs
1天前
已完结
Small channel cold plate flow field and bionic rib structure design for high heat flux electronic devices cooling
1天前
已关闭
Porosity-tunable LPBF copper wicks directly printed on silicon for high-heat-flux cooling: Thermal, mechanical, and reliability characteristics as a function of laser processing conditions
7天前
已关闭
A Novel Double-Layer Manifold Design for Uniform Cooling of Multiple Sic Power Modules
7天前
已完结
Electrochemical additive manufacturing-based cold plate with distributed inlet nozzles and outlet slots for high-power-density electronics cooling
13天前
已完结
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
16天前
已完结
Negative Gate Bias Induced $V_{\mathrm{t}\mathrm{h}}$ Instability in SiC MOSFET: Role of Body Diode Conduction
22天前
已关闭
Analysis of factors influencing the thermal characteristics of multichip parallel packaging in power devices
24天前
已完结
Experimental Characterization And Server-Level Demonstration Of Confined, Direct-On-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation
29天前
已完结
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
1个月前
已完结
皖公网安备34019202002308
