Lv7
3670 积分 2024-07-02 加入
High-efficiency thermal management of variable-load IGBT power modules using microchannel heat sinks and graphite sheet
8天前
已完结
Measurement and Modeling of Bond Wire Degradation in TO-Packaged SiC MOSFETs
9天前
已完结
Wide-bandgap semiconductors and power electronics as pathways to carbon neutrality
15天前
已完结
A review of development and applications of SiC power devices in packaging and interconnect technology
26天前
已完结
A comprehensive review on the enhancement of heat sink cooling effect in microchannel heat exchangers by nanofluids
2个月前
已完结
Design and experimental investigation of a three-dimensional topology-optimized heat sink for IGBT unit cooling
2个月前
已关闭
Synergistic thermal management of heterogeneous 2.5D integration: Embedded manifold microchannel cooling for high-flux heat dissipation and thermal crosstalk suppression
2个月前
已完结
Frequency-Dependent Internal Gate Resistance of SiC Power MOSFETs
2个月前
已完结
Heat transfer and fluid flow analysis of microchannel heat sinks with periodic vertical porous ribs
2个月前
已完结
Small channel cold plate flow field and bionic rib structure design for high heat flux electronic devices cooling
2个月前
已关闭
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