Lv7
5018 积分 2021-05-26 加入
Reliability of SMT Connectors Due to Thermal and Mechanical Fatigue
1个月前
已关闭
Evaluation of liquid crystal polymers for electronic connector applications
1个月前
已完结
Dynamic warpage simulation of molded PCB under reflow process
2个月前
已完结
A Simplified Method for Analyzing PCB Warpage During Reflow: Focusing on Warpage Change and Initial Warpage Shape
2个月前
已完结
High Density Interconnect (HDI) Socket Dynamic Warpage Prediction by Mori-Tanaka Model
2个月前
已完结
High Density Interconnect (HDI) Socket Flow & Waprage Prediction & Characterization
2个月前
已完结
Predicting the elasto-plastic response of short fiber reinforced composites using a computationally efficient multi-scale framework based on physical matrix properties
3个月前
已完结
Cold Plate Cooling Investigation for High-Speed Electronic Interconnect
3个月前
已完结
FE-based damage modeling approach for short fiber reinforced thermoplastics under quasi-static load coupling anisotropic viscoplasticity and matrix degradation
5个月前
已完结
Fiber orientation and mechanical properties of short‐fiber‐reinforced injection‐molded composites: Simulated and experimental results
5个月前
已完结
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