| 标题 |
High Density Interconnect (HDI) Socket Flow & Waprage Prediction & Characterization |
| 网址 | |
| DOI | |
| 其它 |
期刊:2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 作者:Renn Chan Ooi; Franco Costa; Sam Hsieh; Ethan Chiu; Wendy Xu; et al 出版日期:2023-01-19 |
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(2025-6-4)