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78 积分 2025-11-25 加入
The Anand parameters for SAC solders after extreme aging
1天前
待确认
The Influence of Soldering Profile on the Thermal Parameters of Insulated Gate Bipolar Transistors (IGBTs)
23天前
已完结
A Power Loss Calculation Method of IGBT Three-Phase SPWM Converter
1个月前
已完结
Stray inductance estimation with detailed model of the IGBT module
1个月前
已完结
Cohesive zone experiments for copper/mold compound delamination
1个月前
已完结
Novel in-situ button shear methodology for efficient assessment of mold compound encapsulation
1个月前
已完结
Thermomechanical analysis of composite plates curing process using ANSYS composite cure simulation
2个月前
已完结
Effects of Molding Compound Cure on Warpage of Electronic Packages
2个月前
已完结
Method of Improving Simulation Accuracy by Curing Shrinkage of Molding Compound
2个月前
已完结
CTE difference decrease of epoxy molding compound after molding and after PMC
2个月前
已完结
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