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46 积分 2026-08-07 加入
Functionally graded materials fabricated through fused deposition modelling technique-mechanical property evaluation and failure mechanism
17天前
已完结
Preparation and Properties Investigation of Polyphenylene Oxide Modified Epoxy Resin Composites for High‐Frequency Copper Clad Laminates
18天前
已完结
Silicon-containing branched chains active esters as curing agents to improve dielectric properties of epoxy resin
18天前
已完结
Remarkably boosted high-temperature energy storage of a polymer dielectric induced by polymethylsesquioxane microspheres
19天前
已完结
3D Printing of 2 layered permittivity-graded material using UV-cured-resin/alumina composite
19天前
已完结
Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging
19天前
已完结
Direct-Write Printed Epoxy Composites with Layered Gradient Structure: Shape Memory and Electromagnetic Shielding Performance
19天前
已完结
Rational design of POSS containing low dielectric resin for SLA printing electronic circuit plate composites
28天前
已完结
Core-shell engineered boron nitride nanotubes for enhancing dielectric properties of epoxy composites
28天前
已完结
Achieving low dielectric constant and high thermal conductivity polymer composites by using larger POSS functionalized boron nitride nanosheets
29天前
已完结
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